| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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11 pcs
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11 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 563002B00000G is a board level vertical heat sink from Aavid, Thermal Division of Boyd Corporation, designed specifically for TO-220 semiconductor packages. It is constructed from aluminum with a black anodized finish, providing effective heat dissipation and corrosion resistance.
Key thermal specifications include a thermal resistance of 13°C/W under natural convection and 7°C/W at 200 LFM forced air flow. The heat sink can dissipate 1.0W at a 20°C temperature rise. Its rectangular finned shape enhances surface area for improved thermal performance.
Mechanical dimensions are 29.97mm length, 25.40mm width, and 12.70mm fin height. Attachment is achieved via bolt-on and PC pin methods, making it suitable for vertical mounting on printed circuit boards. This heat sink is ideal for cooling power transistors, voltage regulators, and other TO-220 devices in various electronic applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $3.53 | $3.53 |
| 10+ | $2.80 | $2.80 |
| 25+ | $2.71 | $2.71 |
| 50+ | $2.64 | $2.64 |
| 100+ | $2.54 | $2.54 |
| 250+ | $2.44 | $2.44 |
| 500+ | $2.02 | $2.02 |
| 1,000+ | $1.99 | $1.99 |
| 2,000+ | $1.33 | $1.33 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
This heat sink is designed for TO-220 packages.
13°C/W in natural convection and 7°C/W at 200 LFM forced air.
Aluminum with black anodized finish.
Bolt on and PC pin.
RoHS3 compliant (unverified).
Length 29.97mm, width 25.40mm, fin height 12.70mm.
1.0W at 20°C temperature rise.