| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,063 pcs
|
1063 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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This board level heat sink from Aavid, Thermal Division of Boyd Corporation, is designed for cooling DIP packages. It features a top mount aluminum construction with a black anodized finish for enhanced thermal performance and durability. The heat sink measures 22.61 mm in length, 15.24 mm in width, and has a fin height of 10.42 mm. Thermal resistance is rated at 20°C/W under natural convection and improves to 12°C/W with 200 LFM forced air. It can dissipate up to 1W at a 20°C temperature rise. The attachment method supports press fit or slide on installation, making it suitable for 14-DIP and 16-DIP packages. This compact heat sink is ideal for board-level thermal management in various electronic applications.
| Qty | Low | High |
|---|---|---|
| 1,000+ | $1.89 | $1.89 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It is designed for 14-DIP and 16-DIP packages.
20°C/W under natural convection and 12°C/W at 200 LFM forced air.
Aluminum with a black anodized finish.
Yes, it is listed as RoHS3 Compliant (unverified).
By press fit or slide on method.
1W at a 20°C temperature rise.
Length 22.61 mm, width 15.24 mm, fin height 10.42 mm.