| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,008 pcs
|
1008 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 5536501-1 is a Z-PACK Futurebus+ header connector from TE Connectivity designed for high-density backplane applications. This connector features 24 male pins arranged in 4 rows with a 2mm pitch, providing reliable signal interconnection in a compact footprint.
The header uses through hole mounting with solder termination for secure mechanical attachment to the PCB. Contacts are finished with 30.0µin (0.76µm) gold plating, ensuring excellent conductivity and corrosion resistance over repeated mating cycles. A built-in board guide aids alignment during assembly.
Part of the Z-PACK family, this connector is suitable for specialized backplane systems requiring Futurebus+ compatibility. The 2mm centerline spacing supports dense routing while maintaining signal integrity.
| Qty | Low | High |
|---|---|---|
| 1+ | $9.87 | $9.87 |
| 10+ | $8.39 | $8.39 |
| 48+ | $7.51 | $7.51 |
| 96+ | $7.15 | $7.15 |
| 144+ | $6.95 | $6.95 |
| 288+ | $6.62 | $6.62 |
| 528+ | $6.34 | $6.34 |
| 1,008+ | $6.06 | $6.06 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
24 positions, all loaded.
2.00mm (0.079 inches).
Through hole with solder termination.
Gold, 30.0µin (0.76µm) thickness.
RoHS3 Compliant (unverified).