| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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2,568 pcs
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2568 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 551002B00000G is a board level heat sink designed for cooling TO-220 packages. It features a rectangular fin shape and is constructed from aluminum with a black anodized finish for enhanced thermal performance and corrosion resistance.
The heat sink measures 36.83mm in length, 25.55mm in width, and has a fin height of 19.99mm. It offers a thermal resistance of 4.00°C/W at 300 LFM forced air flow and 12.40°C/W under natural convection. Power dissipation is rated at 1.5W for a 20°C temperature rise.
Mounting is via bolt-on attachment, making it suitable for secure installation on TO-220 devices. This heat sink is ideal for applications requiring efficient thermal management in power electronics, such as voltage regulators, power transistors, and motor control circuits.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.03 | $1.03 |
| 10+ | $0.90 | $0.90 |
| 25+ | $0.88 | $0.88 |
| 50+ | $0.86 | $0.86 |
| 100+ | $0.81 | $0.81 |
| 250+ | $0.76 | $0.76 |
| 500+ | $0.76 | $0.76 |
| 1,000+ | $0.64 | $0.64 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It is a board level heat sink.
It is designed to cool TO-220 packages.
Aluminum with black anodized finish.
Length 36.83mm, width 25.55mm, fin height 19.99mm.
4.00°C/W at 300 LFM forced air flow, 12.40°C/W natural convection.
1.5W at 20°C temperature rise.
RoHS status is marked as RoHS3 compliant but unverified.