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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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122 pcs
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122 pcs | On Request | 1 | On Request | On Request | NO DC | On Request | On Request |
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The 542502B00000G is a board level, vertical heat sink from Aavid, Thermal Division of Boyd Corporation, designed for cooling TO-220 semiconductor packages. It features a rectangular fin shape and is constructed from aluminum with a black anodized material finish.
This heat sink offers a nominal thermal resistance of 24.00°C/W under natural convection conditions. Under forced air flow at 700 LFM, the thermal resistance drops to 4.00°C/W. It can dissipate up to 2.5W at a 60°C temperature rise.
The heat sink measures 31.75mm (1.250") in length, 22.22mm (0.875") in width, with a fin height of 0.250" (6.35mm). It supports both bolt-on and PC pin attachment methods for secure mounting to the TO-220 package and the circuit board.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.51 | $2.51 |
| 10+ | $2.21 | $2.21 |
| 50+ | $2.12 | $2.12 |
| 100+ | $2.08 | $2.08 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The thermal resistance is 24.00°C/W in natural convection and 4.00°C/W at 700 LFM forced air flow.
It is designed for the TO-220 package.
It can dissipate 2.5W at a 60°C temperature rise.
It is made of aluminum with a black anodized finish.
Length is 31.75mm (1.250"), width is 22.22mm (0.875"), and fin height is 0.250" (6.35mm).
It uses bolt-on and PC pin attachment methods.