| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
8 pcs
|
8 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| China RoHS | |
| Connector Style | |
| Connector Type | |
| Contact Finish | |
| Contact Finish Thickness | |
| EU ELV | |
| Features | |
| Halogen Content | |
| Lead Spacing | |
| Lead Style | |
| Mounting Type | |
| Number of Positions | |
| Number of Positions Loaded | |
| Number of Rows | |
| Pitch | |
| Solder Process Capability | |
| Termination |
The TE Connectivity 536501-2 is a Futurebus+ backplane connector header designed for high-density signal applications. It features 48 positions arranged in 4 rows with a 2.00mm pitch, providing a compact interconnect solution for backplane systems.
This through-hole header uses solder termination and gold-plated contacts with a thickness of 30.0µin (0.76µm) for reliable signal integrity. The connector includes a board guide feature to assist with alignment during assembly.
The part is rated for pin-in-paste soldering processes up to 260°C. It is classified as low halogen with bromine, chlorine, fluorine, and iodine each below 900 ppm per homogenous material, and is BFR/CFR/PVC free.
| Qty | Low | High |
|---|---|---|
| 864+ | $5.71 | $5.71 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It is a Header, Male Pins connector in the Futurebus style.
It has 48 positions arranged in 4 rows.
The pitch is 2.00mm.
It is a through hole mounting connector with solder termination.
The contact finish is gold with a thickness of 30.0µin (0.76µm).
No, it is not RoHS compliant due to lead (Pb) content.
It is low halogen: Br, Cl, F, I each < 900 ppm per homogenous material, and BFR/CFR/PVC free.