534202B03453G Board level heat sink for TO-220 packages. Features 0.5" fin height, aluminum construction, and black anodized finish.
Mfr Part #:

534202B03453G

Available from 1 distributors
Mfr Name: Aavid, Thermal Division of Boyd Corporation
Aavid, Thermal Division of Boyd Corporation
Board level heat sink for TO-220 packages. Features 0.5" fin height, aluminum construction, and black anodized finish.
Total Stock: 14,400 pcs
$ Price Range: $0.97 - $3.34

534202B03453G Available from 1 distributor

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Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
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14,400 pcs
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534202B03453G Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Lead Style
Length
Material
Material Finish
Mounting Type
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Type
Width

534202B03453G Description

Short technical summary and product information.

The 534202B03453G is a board level heat sink designed for TO-220 packages. It features a rectangular, vertical fin design with a fin height of 0.500" (12.70mm), a length of 1.180" (29.97mm), and a width of 1.000" (25.40mm). The heat sink is constructed from aluminum with a black anodized finish, offering good corrosion resistance and thermal performance.

 

Thermal performance is characterized by a natural convection thermal resistance of 13.40°C/W and a forced air thermal resistance of 6.00°C/W at 300 LFM. At a 20°C temperature rise, the heat sink dissipates 1.0W. The attachment method uses clip and board locks, ensuring secure mounting to the board.

 

This heat sink is suitable for vertical board mounting and is intended for cooling TO-220 semiconductor packages in applications requiring efficient heat removal. The black anodized finish enhances radiation heat transfer and provides a durable surface.

 

Typical applications include power supplies, voltage regulators, and other electronic devices using TO-220 packages where thermal management is critical.

534202B03453G Quick Information

Product Type: Heat Sink
Canonical Name: Board Level Heat Sink for TO-220 Package
Subcategory: Board Level Heat Sinks

534202B03453G Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

534202B03453G Estimated Pricing

Qty Low High
1+ $3.34 $3.34
10+ $2.94 $2.94
25+ $2.80 $2.80
50+ $2.70 $2.70
100+ $2.58 $2.58
250+ $2.52 $2.52
500+ $1.42 $1.42
1,200+ $1.35 $1.35
2,400+ $0.97 $0.97

Estimated market price range - modelled values for guidance only, not live distributor offers.

534202B03453G Features

  • Aluminum construction with black anodized finish.
  • 13.4°C/W natural convection thermal resistance.
  • 6.0°C/W thermal resistance at 300 LFM.
  • Designed for TO-220 package cooling.
  • Attaches via clip and board locks.

534202B03453G Applications

  • Used for cooling TO-220 semiconductor packages.
  • Suitable for vertical board mounting applications.
  • Supports forced air cooling at 300 LFM.

534202B03453G FAQs

5 frequently asked questions generated from this part’s specifications.
What package is this heat sink designed to cool?

This heat sink is designed to cool TO-220 packages.

Is this product RoHS compliant?

The product is listed as RoHS3 compliant.

What is the thermal resistance of this heat sink?

Natural convection thermal resistance is 13.40°C/W, and at 300 LFM forced air it is 6.00°C/W.

What material is this heat sink made of?

Aluminum with a black anodized finish.

What is the mounting method for this heat sink?

Clip and board locks.

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