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54 pcs
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54 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 534202B02853G is a board level vertical heat sink designed for cooling TO-220 semiconductor packages. Manufactured by Aavid, Thermal Division of Boyd Corporation, this heat sink is constructed from aluminum with a black anodized finish for enhanced thermal performance and corrosion resistance.
Key specifications include a thermal resistance of 13.40°C/W under natural convection and 6.00°C/W under forced air at 300 LFM. It can dissipate 1.0W at a 20°C temperature rise. The heat sink measures 25.40mm (1.000") in width and 29.97mm (1.180") in length, with a fin height of 0.500" (12.70mm).
Attachment is via a clip and board locks, providing secure mounting to the PCB. The rectangular finned shape maximizes surface area for efficient heat dissipation in vertical orientation.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.32 | $1.32 |
| 486+ | $1.20 | $1.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The thermal resistance is 13.40°C/W under natural convection and 6.00°C/W under forced air at 300 LFM.
This heat sink is designed for TO-220 packages.
It is made of aluminum with a black anodized finish.
It attaches using a clip and board locks.
Width is 25.40mm (1.000"), length is 29.97mm (1.180"), and fin height is 0.500" (12.70mm).
It can dissipate 1.0W at a 20°C temperature rise.
RoHS3 compliance is indicated but unverified.