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792 pcs
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792 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 533802B02500G is a board level vertical heat sink designed for cooling TO-220 semiconductor packages. It is manufactured from black anodized aluminum, providing effective heat dissipation in a compact form factor.
With dimensions of 25.40mm (1.000") length and 34.93mm (1.375") width, and a fin height of 0.500" (12.70mm), this heat sink offers a thermal resistance of 13.00°C/W under natural convection and 4.00°C/W at 700 LFM forced air flow. It can dissipate up to 3.0W with a temperature rise of 50°C.
The heat sink features a rectangular finned shape and attaches to the PCB via through-hole PC pins, making it suitable for vertical mounting on circuit boards. The TO-220 package is secured directly to the heat sink for efficient thermal transfer.
| Qty | Low | High |
|---|---|---|
| 5,940+ | $6.06 | $6.06 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
This heat sink is designed for the TO-220 package.
The part is listed as RoHS3 compliant, but this status is unverified and should be confirmed.
Thermal resistance is 13.00°C/W in natural convection and 4.00°C/W at 700 LFM forced air flow.
Power dissipation is 3.0W at a 50°C temperature rise.
It is made of aluminum with a black anodized finish.
The heat sink attaches via through-hole PC pins.
Length is 25.40mm (1.000"), width is 34.93mm (1.375"), and fin height is 0.500" (12.70mm).