| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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344 pcs
|
344 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
344 pcs
|
344 pcs | On Request | 1 | On Request | On Request | 1970-01-01 00:15:32 | On Request | On Request |
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The Molex 53309-2870 is a board-to-board wafer assembly designed for high-density interconnects. It features 28 contacts with a 0.8mm pitch, providing a compact connection solution. The right-angle orientation and surface mount packaging facilitate efficient PCB assembly. This connector is part of the Molex 53309 series, suitable for mezzanine board-to-board applications.
It has 28 contacts.
The pitch is 0.8 mm.
It is surface mount (SMT).
It belongs to the Molex 53309 series.
The component is listed as RoHS3 compliant, but this information has not been verified.