| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
13 pcs
|
13 pcs | On Request | 1 | On Request | On Request | NO DC | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Adhesive | |
| Color | |
| Material | |
| Outline | |
| Shape | |
| Thermal Conductivity | |
| Thickness | |
| Type | |
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This thermal pad (53-02-103AC) from Aavid, Thermal Division of Boyd Corporation is a silicone rubber interface pad designed for TO-218 semiconductor packages. It features a thickness of 0.152mm (0.0060 inches) and a thermal conductivity of 0.9W/m-K, providing effective heat transfer between the component and heatsink. The pad has adhesive on one side for easy installation and is available in gray/green color. Its 5-sided polygon shape with outline dimensions of 23.08mm x 19.05mm is tailored for TO-218 outlines. This pad is RoHS3 compliant and has an MSL of 1 (unlimited). It is suitable for thermal management in various electronic assemblies requiring electrical isolation and heat dissipation.
| Qty | Low | High |
|---|---|---|
| 6,000+ | $0.70 | $0.70 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
Yes, it is RoHS3 compliant.
0.152mm (0.0060 inches).
0.9W/m-K.
23.08mm x 19.05mm.
Yes, adhesive on one side.
Silicone rubber.