| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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1,440 pcs
|
1440 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 529801B02500G is a board level heat sink from Aavid, Thermal Division of Boyd Corporation, part of the Extruded 5290 series. It is designed for cooling TO-218 semiconductor packages in a vertical orientation. The heat sink features a rectangular fin geometry made from aluminum with a black anodized finish.
Key thermal specifications include a thermal resistance of 5.00°C/W under natural convection and 2.00°C/W at 500 LFM forced air flow. Power dissipation is rated at 10.0W for a 50°C temperature rise. Mechanical dimensions are 38.10mm length, 41.91mm width, and 25.40mm fin height.
Attachment is achieved via bolt-on and PC pin methods, making it suitable for direct mounting to the device and PCB. The black anodized coating enhances heat radiation and corrosion resistance. This heat sink is ideal for applications requiring efficient thermal management of TO-218 devices in power electronics.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.20 | $2.20 |
| 10+ | $1.96 | $1.96 |
| 25+ | $1.91 | $1.91 |
| 50+ | $1.81 | $1.81 |
| 100+ | $1.72 | $1.72 |
| 180+ | $1.63 | $1.63 |
| 540+ | $1.56 | $1.56 |
| 1,080+ | $1.51 | $1.51 |
| 2,520+ | $1.41 | $1.41 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The heat sink is designed to cool TO-218 packages.
Thermal resistance is 5.00°C/W in natural convection and 2.00°C/W at 500 LFM forced air flow.
Power dissipation is 10.0W at a 50°C temperature rise.
Length is 38.10mm, width is 41.91mm, and fin height is 25.40mm.
It is made of aluminum with a black anodized finish.
Attachment is via bolt-on and PC pin methods.
It is listed as RoHS3 Compliant, but this is unverified and low confidence.