5120787-1

This TE Connectivity Z-PACK HS3 series backplane receptacle offers 30 positions arranged in 6 rows and 5 columns. The connector features a dual beam center contact design for reliable connections in high-density backplane applications. It uses press-fit termination for through-hole mounting at a right angle, eliminating the need for soldering. The housing is made of liquid crystal polymer (LCP) with UL94V-0 flammability rating. Contacts are copper alloy with gold finish (30.0µin) for low resistance and corrosion resistance. The shield is phosphor bronze. With a 2.50mm pitch, this connector supports compact PCB layouts.

Designed for backplane interconnections, this receptacle is suitable for telecommunications, data networking, and industrial control systems. The dual beam contacts provide multiple points of contact for enhanced signal integrity. The press-fit termination ensures a reliable mechanical and electrical connection without thermal stress.

For design considerations, refer to TE Connectivity application specification 114-13020 for recommended plated through hole diameter and plating thickness. The contact mating area meets performance requirements of TE product specification 108-1957 based on Telcordia GR-1217-CORE.