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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
19 pcs
|
19 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Contact Finish | |
| Contact Finish Thickness | |
| Contact Material | |
| Features | |
| Housing Material | |
| Lead Spacing | |
| Lead Style | |
| Mounting Type | |
| Number of Positions or Pins (Grid) | |
| Operating Temperature | |
| Pitch | |
| Tape & Reel | |
| Termination | |
| Termination Style | |
| Type |
The Preci-Dip 510-83-240-17-061101 is a PGA (Pin Grid Array) socket designed for IC packaging. It features 240 positions arranged in a 17x17 grid with a standard 2.54mm pitch. The socket is through hole mount with solder termination, and uses an open frame construction. Contacts are made of beryllium copper with a tin finish of 29.5µin thickness. The housing is made of polycyclohexylenedimethylene terephthalate (PCT) / polyester, glass filled. Operating temperature range is -55°C to 125°C. This socket is suitable for high reliability applications requiring secure connections for PGA packaged ICs. The open frame design allows for better airflow and heat dissipation. The socket is RoHS compliant and REACH unaffected (unverified).
| Qty | Low | High |
|---|---|---|
| 288+ | $22.64 | $22.64 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
240 positions arranged in a 17x17 grid.
2.54mm (0.100 inches).
Through hole mount with solder termination.
-55°C to 125°C.
Beryllium copper.
Tin finish, 29.5µin (0.75µm) thick.
Polycyclohexylenedimethylene Terephthalate (PCT), polyester, glass filled.