| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
10,000 pcs
|
10000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
10 pcs
|
10 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Length | |
| Material | |
| Material Finish | |
| Package Cooled | |
| Power Dissipation @ Temperature Rise | |
| Shape | |
| Tape & Reel | |
| Thermal Resistance @ Forced Air Flow | |
| Thermal Resistance @ Natural | |
| Type | |
| Width |
This board level heat sink is designed for cooling TO-220 semiconductor packages. It features a square finned shape made from aluminum with a black anodized finish for enhanced thermal performance and corrosion resistance. The heat sink measures 19.05mm (0.750") in both length and width, with a fin height of 9.65mm (0.380"). It attaches via bolt-on method.
Thermal performance: 24.00°C/W in natural convection, improving to 10.00°C/W at 200 LFM forced air flow. Power dissipation is rated at 2.5W for a 60°C temperature rise. Suitable for low-profile applications where space is limited.
The heat sink is listed as RoHS3 compliant and has MSL 1 unlimited moisture sensitivity level. It is manufactured by Aavid, Thermal Division of Boyd Corporation.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.34 | $0.34 |
| 10+ | $0.30 | $0.30 |
| 25+ | $0.29 | $0.29 |
| 50+ | $0.28 | $0.28 |
| 100+ | $0.27 | $0.27 |
| 250+ | $0.25 | $0.25 |
| 500+ | $0.24 | $0.24 |
| 1,000+ | $0.23 | $0.23 |
| 5,000+ | $0.21 | $0.21 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
This heat sink is designed for TO-220 packages.
Yes, it is listed as RoHS3 compliant (unverified).
24.00°C/W in natural convection and 10.00°C/W at 200 LFM forced air.
19.05mm x 19.05mm square with 9.65mm fin height.