| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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6,600 pcs
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6600 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 507222B00000G is a board level heat sink from the Hat Section 5070 series by Aavid, Thermal Division of Boyd Corporation. It is specifically designed to cool TO-220 semiconductor packages. The heat sink measures 37.34mm in height, 44.45mm in width, and 9.52mm in length, and is constructed from aluminum with a black anodized finish for enhanced thermal emissivity and corrosion resistance.
Thermal performance is characterized by a typical thermal resistance of 9.60°C/W under natural convection and 3.00°C/W at 200 LFM forced air flow. It can dissipate up to 8.0W at a 70°C temperature rise. The heat sink uses a bolt-on attachment method and can be mounted in either horizontal or vertical orientation. A mounting kit and thermal interface material are required but not included.
This heat sink is suitable for a variety of board-level thermal management applications where TO-220 devices need efficient cooling. Its compact footprint allows integration into space-constrained designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.74 | $1.74 |
| 10+ | $1.63 | $1.63 |
| 50+ | $1.62 | $1.62 |
| 100+ | $1.59 | $1.59 |
| 250+ | $1.55 | $1.55 |
| 1,200+ | $1.42 | $1.42 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
This heat sink is designed for TO-220 packages.
It is listed as RoHS3 compliant, but this is unverified and should be confirmed with the manufacturer.
The typical thermal resistance in natural convection is 9.60°C/W.
The typical thermal resistance at 200 LFM forced air is 3.00°C/W.
The heat sink is made of aluminum with a black anodized finish.
The dimensions are: height 37.34mm, width 44.45mm, length 9.52mm.
The heat sink uses a bolt-on attachment method.