| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
3,000 pcs
|
3000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
81 pcs
|
81 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Package Cooled | |
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| Tape & Reel | |
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The 504102B00000G is a board level heat sink designed to cool TO-220 semiconductor devices. It is constructed from aluminum with a black anodized finish, providing effective heat dissipation. The heat sink measures 19.80mm in width, 21.59mm in length, and 17.80mm in height. It offers a thermal resistance of 15.6°C/W in natural convection and 6.0°C/W at 300 LFM forced air flow. Power dissipation is rated at 2.0W for a 40°C temperature rise. The heat sink attaches via bolt-on mounting and can be oriented vertically or horizontally. It is suitable for various board-level thermal management applications including power supplies and motor control circuits.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.48 | $0.48 |
| 10+ | $0.43 | $0.43 |
| 25+ | $0.41 | $0.41 |
| 50+ | $0.40 | $0.40 |
| 100+ | $0.39 | $0.39 |
| 250+ | $0.36 | $0.36 |
| 500+ | $0.35 | $0.35 |
| 1,000+ | $0.33 | $0.33 |
| 3,000+ | $0.30 | $0.30 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It is designed to cool TO-220 packages.
The thermal resistance is 15.6°C/W in natural convection.
At 300 LFM forced air flow, the thermal resistance is 6.0°C/W.
It is rated for 2.0W power dissipation at a 40°C temperature rise.
It is aluminum with a black anodized finish.
It uses bolt-on attachment.
It is listed as RoHS3 compliant, but this is unverified.