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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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11 pcs
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11 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 501503B00000G is a board level heat sink designed for cooling TO-3 semiconductor packages. It features a rhombus shape and is constructed from aluminum with a black anodized finish for enhanced thermal performance and corrosion resistance. The heat sink measures 1.880" (47.75mm) in length, 1.400" (35.56mm) in width, and has a fin height of 1.000" (25.40mm). It uses a bolt-on attachment method for secure mounting to the component.
Thermal performance is specified at 8.40°C/W under natural convection and improves to 2.00°C/W at 500 LFM forced air flow. The heat sink can dissipate 5.0W at a 40°C temperature rise. These characteristics make it suitable for applications requiring efficient heat removal from TO-3 power devices in both natural and forced air environments.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.67 | $2.67 |
| 10+ | $2.40 | $2.40 |
| 25+ | $2.31 | $2.31 |
| 50+ | $2.24 | $2.24 |
| 100+ | $2.09 | $2.09 |
| 250+ | $2.04 | $2.04 |
| 500+ | $2.02 | $2.02 |
| 1,000+ | $1.18 | $1.18 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-3
8.40°C/W natural convection, 2.00°C/W at 500 LFM forced air
5.0W at 40°C temperature rise
Aluminum with black anodized finish
1.880" length, 1.400" width, 1.000" fin height
RoHS3 Compliant (unverified)
Bolt on