501403B00000G Board level heat sink for TO-3 packages. Rhombus shape, aluminum, black anodized, bolt-on mounting.
Mfr Part #:

501403B00000G

Available from 1 distributors
Mfr Name: Aavid, Thermal Division of Boyd Corporation
Aavid, Thermal Division of Boyd Corporation
Board level heat sink for TO-3 packages. Rhombus shape, aluminum, black anodized, bolt-on mounting.
Total Stock: 193 pcs
$ Price Range: $1.88 - $3.14

501403B00000G Available from 1 distributor

Authorised
Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
193 pcs
193 pcs On Request 1 On Request On Request 2026-02-25 06:16:38 On Request On Request

501403B00000G Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Length
Material
Material Finish
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Type
Width

501403B00000G Description

Short technical summary and product information.

The 501403B00000G is a board level heat sink from Aavid, Thermal Division of Boyd Corporation, designed specifically for TO-3 semiconductor packages. It features a rhombus shape and is constructed from aluminum with a black anodized finish, which enhances thermal performance and corrosion resistance. The heat sink measures 47.75mm (1.880") in length and 35.56mm (1.400") in width, with a fin height of 0.750" (19.05mm).

 

Thermal performance specifications include a natural convection thermal resistance of 10.00°C/W and a forced air thermal resistance of 3.00°C/W at 400 LFM airflow. At a 40°C temperature rise, it can dissipate up to 4.0W of power. The bolt-on attachment method ensures secure and reliable mounting to the TO-3 package.

 

This heat sink is suitable for applications requiring efficient thermal management in compact board-level designs. The black anodized coating provides electrical insulation and improves heat radiation. Its mechanical dimensions and rhombus shape allow integration into space-constrained layouts where traditional rectangular heat sinks may not fit.

501403B00000G Quick Information

Product Type: Board Level Heat Sink
Series: 501403B
Canonical Name: Board Level Heat Sink for TO-3, Rhombus, Aluminum, Black Anodized
Subcategory: Heat Sinks

501403B00000G Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

501403B00000G Estimated Pricing

Qty Low High
1+ $3.14 $3.14
10+ $2.78 $2.78
25+ $2.73 $2.73
50+ $2.65 $2.65
100+ $2.54 $2.54
250+ $2.42 $2.42
500+ $2.33 $2.33
1,000+ $1.88 $1.88

Estimated market price range - modelled values for guidance only, not live distributor offers.

501403B00000G Features

  • Designed for TO-3 package cooling.
  • Aluminum construction with black anodized finish.
  • Rhombus shape for compact board layouts.
  • Thermal resistance 3.00°C/W at 400 LFM.
  • Bolt-on attachment method for secure mounting.

501403B00000G Applications

  • For cooling TO-3 transistors in power circuits.
  • Suitable for board-level thermal management in electronics.
  • Used in applications requiring natural or forced air cooling.

501403B00000G FAQs

7 frequently asked questions generated from this part’s specifications.
Which package is this heat sink designed for?

TO-3 package.

What material is this heat sink made of?

Aluminum with black anodized finish.

How is the heat sink attached?

Bolt on method.

What is the thermal resistance with forced airflow?

3.00°C/W at 400 LFM.

What is the natural convection thermal resistance?

10.00°C/W.

How much power can it dissipate?

Up to 4.0W at 40°C temperature rise.

Is this heat sink RoHS compliant?

Yes, RoHS3 compliant (unverified, low confidence).

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