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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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193 pcs
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193 pcs | On Request | 1 | On Request | On Request | 2026-02-25 06:16:38 | On Request | On Request |
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The 501403B00000G is a board level heat sink from Aavid, Thermal Division of Boyd Corporation, designed specifically for TO-3 semiconductor packages. It features a rhombus shape and is constructed from aluminum with a black anodized finish, which enhances thermal performance and corrosion resistance. The heat sink measures 47.75mm (1.880") in length and 35.56mm (1.400") in width, with a fin height of 0.750" (19.05mm).
Thermal performance specifications include a natural convection thermal resistance of 10.00°C/W and a forced air thermal resistance of 3.00°C/W at 400 LFM airflow. At a 40°C temperature rise, it can dissipate up to 4.0W of power. The bolt-on attachment method ensures secure and reliable mounting to the TO-3 package.
This heat sink is suitable for applications requiring efficient thermal management in compact board-level designs. The black anodized coating provides electrical insulation and improves heat radiation. Its mechanical dimensions and rhombus shape allow integration into space-constrained layouts where traditional rectangular heat sinks may not fit.
| Qty | Low | High |
|---|---|---|
| 1+ | $3.14 | $3.14 |
| 10+ | $2.78 | $2.78 |
| 25+ | $2.73 | $2.73 |
| 50+ | $2.65 | $2.65 |
| 100+ | $2.54 | $2.54 |
| 250+ | $2.42 | $2.42 |
| 500+ | $2.33 | $2.33 |
| 1,000+ | $1.88 | $1.88 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-3 package.
Aluminum with black anodized finish.
Bolt on method.
3.00°C/W at 400 LFM.
10.00°C/W.
Up to 4.0W at 40°C temperature rise.
Yes, RoHS3 compliant (unverified, low confidence).