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501303B00000G Board level heat sink for TO-3 package, 12.70mm fin height, black anodized aluminum, bolt-on attachment.
Mfr Part #:

501303B00000G

Available from 1 distributors
Mfr Name: Aavid, Thermal Division of Boyd Corporation
Aavid, Thermal Division of Boyd Corporation
Board level heat sink for TO-3 package, 12.70mm fin height, black anodized aluminum, bolt-on attachment.
✓ Total Stock: 15 pcs
$ Price Range: $1.09 - $1.74

501303B00000G Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Speed Components Ltd ✓
Non-Authorised Inventory information
15 pcs
On Request
15 pcs On Request 1 On Request On Request 06+ On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

501303B00000G Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Length
Material
Material Finish
Package Cooled
Power Dissipation @ Temperature Rise
SVHC Present
Shape
Tape & Reel
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Type
Width
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501303B00000G Description

Short technical summary and product information.

The 501303B00000G is a board level heat sink designed for cooling TO-3 semiconductor packages. It features a rhombus shape and is constructed from black anodized aluminum for efficient heat dissipation and corrosion resistance. The heat sink measures 47.75mm in length, 35.56mm in width, and has a fin height of 12.70mm.

 

Thermal performance is specified at 12.00°C/W under natural convection and 4.00°C/W at 300 LFM forced air flow. Power dissipation is rated at 2.0W for a 30°C temperature rise. The bolt-on attachment method ensures secure mounting to the TO-3 package.

 

This heat sink is suitable for applications requiring reliable thermal management in a compact board-level footprint. The black anodized finish provides both aesthetic and functional benefits, including improved emissivity and environmental protection.

501303B00000G Quick Information

Product Type: Heat Sink
Series: 501
Canonical Name: 501303B00000G Heat Sink for TO-3 Package, 12.70mm Fin Height, Black Anodized Aluminum
Subcategory: TO-3 Heat Sink

501303B00000G Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: Non-Compliant
Lead Free: Yes

501303B00000G Estimated Pricing

Qty Low High
1+ $1.74 $1.74
50+ $1.69 $1.69
100+ $1.61 $1.61
250+ $1.31 $1.31
500+ $1.30 $1.30
1,000+ $1.09 $1.09

Estimated market price range - modelled values for guidance only, not live distributor offers.

501303B00000G Features

  • Black anodized aluminum construction.
  • 12.70mm fin height for compact designs.
  • 12.00°C/W thermal resistance natural convection.
  • Bolt-on attachment for TO-3 packages.
  • Rhombus shape for efficient airflow.

501303B00000G Applications

  • Cooling TO-3 power transistors.
  • Board level thermal management.
  • Natural or forced convection environments.
  • Compact electronic assemblies.

501303B00000G FAQs

6 frequently asked questions generated from this part’s specifications.
What is the thermal resistance of this heat sink?

12.00°C/W under natural convection and 4.00°C/W at 300 LFM forced air flow.

What package does this heat sink cool?

It is designed for the TO-3 package.

What are the dimensions of the 501303B00000G?

Length: 47.75mm, Width: 35.56mm, Fin Height: 12.70mm.

What material is the heat sink made of?

Black anodized aluminum.

How is the heat sink attached?

Bolt on attachment method.

What is the power dissipation rating?

2.0W at a 30°C temperature rise.

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