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421F The Wakefield-Vette 421F is a board-level extrusion heat sink designed for TO-3, DO-5, and stud mount packages. It dissipates up to 50W with a thermal resistance of 1.16°C/W in natural convection and 0.70°C/W at 250 LFM forced air.
Mfr Part #:

421F

Available from 1 distributors
Mfr Name: Wakefield-Vette
Wakefield-Vette
The Wakefield-Vette 421F is a board-level extrusion heat sink designed for TO-3, DO-5, and stud mount packages. It dissipates up to 50W with a thermal resistance of 1.16°C/W in natural convection and 0.70°C/W at 250 LFM forced air.
✓ Total Stock: 6 pcs
$ Price Range: $32.26 - $32.27

421F Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Hybrid Electronics ✓
Non-Authorised Inventory information
6 pcs
On Request
6 pcs On Request 1 On Request On Request On Request On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

421F Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Length
Material
Material Finish
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Type
Width
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421F Description

Short technical summary and product information.

The Wakefield-Vette 421F is a rectangular finned heat sink made from black anodized aluminum. It is designed for cooling TO-3, DO-5, and stud mount semiconductor packages. The heat sink measures 120.65mm wide, 76.20mm long, and has a fin height of 66.67mm. It offers a thermal resistance of 1.16°C/W under natural convection and 0.70°C/W with 250 LFM forced airflow, enabling up to 50W power dissipation at a 58°C temperature rise. The attachment method is press fit, making it suitable for board-level applications. This extrusion-style heat sink provides efficient thermal management for power semiconductors in various electronic systems.

421F Quick Information

Product Type: Heat Sink
Series: 421
Canonical Name: Wakefield-Vette 421F Heat Sink, TO-3/DO-5/Stud Mount, 50W, 1.16°C/W Natural Convection
Subcategory: Board Level Heat Sink

421F Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

421F Estimated Pricing

Qty Low High
1+ $32.27 $32.27
75+ $32.26 $32.26

Estimated market price range - modelled values for guidance only, not live distributor offers.

421F Features

  • Dissipates up to 50W at 58°C rise.
  • Thermal resistance 1.16°C/W natural convection.
  • Black anodized aluminum construction.
  • Press fit attachment for TO-3/DO-5 packages.
  • Rectangular finned extrusion design.

421F Applications

  • Cooling power transistors in TO-3 packages.
  • Thermal management for stud mount diodes.
  • Board-level heat sinking for DO-5 devices.
  • Used in industrial power supplies and amplifiers.

421F FAQs

7 frequently asked questions generated from this part’s specifications.
What packages does the 421F heat sink cool?

The 421F is designed for TO-3, DO-5, and stud mount packages.

What is the thermal resistance of the 421F?

Thermal resistance is 1.16°C/W under natural convection and 0.70°C/W at 250 LFM forced air flow.

What is the power dissipation capability of the 421F?

It can dissipate 50W at a 58°C temperature rise.

What are the dimensions of the 421F heat sink?

Width: 120.65mm, Length: 76.20mm, Fin Height: 66.67mm.

What material is the 421F heat sink made of?

It is made of aluminum with a black anodized finish.

What is the attachment method for the 421F?

The attachment method is press fit.

Is the 421F RoHS compliant?

It is listed as RoHS3 compliant, but this is unverified low-confidence data.

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