| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
15 pcs
|
15 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Wakefield-Vette 413A is a board level extrusion heat sink designed for cooling TO-3, DO-5, and Stud Mount semiconductor packages. It is constructed from black anodized aluminum for efficient heat dissipation. The heat sink measures 120.65mm (4.750") in width and 76.20mm (3.000") in length, with a fin height of 66.67mm (2.625"). It uses a press fit attachment method for secure mounting. Under forced air flow of 250 LFM, the thermal resistance is 0.85°C/W, and it can dissipate 50.0W at a 72°C temperature rise. This heat sink is suitable for applications requiring reliable thermal management in power electronics.
| Qty | Low | High |
|---|---|---|
| 1+ | $21.50 | $21.50 |
| 12+ | $20.26 | $20.26 |
| 24+ | $19.07 | $19.07 |
| 60+ | $17.88 | $17.88 |
| 108+ | $16.83 | $16.83 |
| 252+ | $16.03 | $16.03 |
| 504+ | $15.45 | $15.45 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-3, DO-5, and Stud Mount packages.
Yes, it is RoHS3 compliant.
0.85°C/W at 250 LFM forced air flow.
50.0W at a 72°C temperature rise.
Width 120.65mm, length 76.20mm, fin height 66.67mm.
Aluminum with black anodized finish.
Press fit attachment.