| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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49 pcs
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49 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Wakefield-Vette 401F is a board level extrusion heat sink designed for cooling TO-3 semiconductor packages. Constructed from aluminum with a black anodized finish, it features a rectangular fin shape for efficient heat dissipation.
With a thermal resistance of 1.50°C/W at 250 LFM forced air flow, the 401F can dissipate up to 30.0W at a temperature rise of 80°C. The heat sink measures 120.65mm wide, 38.10mm long, with a fin height of 31.75mm. Attachment is via press fit, ensuring secure mounting to the TO-3 package.
This heat sink is suitable for applications requiring forced air cooling. The black anodized finish provides corrosion resistance and improved thermal emissivity.
| Qty | Low | High |
|---|---|---|
| 112+ | $4.30 | $4.30 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-3 package.
Yes, it is RoHS3 compliant.
1.50°C/W at 250 LFM forced air flow.
30.0W at 80°C temperature rise.
Aluminum with black anodized finish.
Width 120.65mm, length 38.10mm, fin height 31.75mm.
Press fit.