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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
22 pcs
|
22 pcs | On Request | 1 | On Request | On Request | 0729 | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Length | |
| Material | |
| Material Finish | |
| Package Cooled | |
| Power Dissipation @ Temperature Rise | |
| Shape | |
| Thermal Resistance @ Forced Air Flow | |
| Thermal Resistance @ Natural | |
| Type | |
| Width |
This is a top mount heat sink designed for BGA packages. It measures 35.00mm x 35.00mm with a fin height of 18.00mm, making it suitable for compact thermal management applications.
Constructed from aluminum with a black anodized finish, the heat sink features a square pin fin shape for efficient heat dissipation. It offers a thermal resistance of 15.30°C/W under natural convection and 5.20°C/W at 200 LFM forced air flow. Power dissipation is rated at 3.0W for a 50°C temperature rise.
Attachment is via included thermal tape or adhesive, simplifying installation on BGA devices. The heat sink is RoHS3 compliant and has an MSL of 1 (unlimited). It is suitable for use in various electronic cooling applications where BGA packages require thermal management.
| Qty | Low | High |
|---|---|---|
| 1+ | $4.16 | $4.16 |
| 10+ | $3.79 | $3.79 |
| 25+ | $3.61 | $3.61 |
| 50+ | $3.48 | $3.48 |
| 100+ | $3.31 | $3.31 |
| 250+ | $3.18 | $3.18 |
| 500+ | $3.13 | $3.13 |
| 672+ | $3.03 | $3.03 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
BGA (Ball Grid Array).
15.30°C/W.
5.20°C/W.
3.0W at 50°C temperature rise.
Aluminum with black anodized finish.
Using included thermal tape or adhesive.
Yes, RoHS3 compliant.