| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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1,107 pcs
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1107 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 374424B00035G is a top-mount heat sink designed for BGA packages. It features a square pin fin design with an 18.00mm fin height and a 27.00mm by 27.00mm footprint. The heat sink is constructed from aluminum with a black anodized finish, providing a durable and thermally efficient surface.
Thermal performance is specified at 6.50°C/W under 200 LFM forced air flow and 20.30°C/W under natural convection. It is rated for 4.0W power dissipation at an 80°C temperature rise. The heat sink includes thermal tape adhesive for attachment, simplifying installation.
This heat sink is suitable for cooling BGA devices in applications where space is limited and moderate thermal management is required. The pin fin design enhances heat dissipation in forced air environments, while the adhesive tape provides a secure mounting method without additional hardware.
| Qty | Low | High |
|---|---|---|
| 20,412+ | $1.99 | $1.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The thermal resistance is 6.50°C/W at 200 LFM forced air flow and 20.30°C/W under natural convection.
It is rated for 4.0W power dissipation at an 80°C temperature rise.
The heat sink measures 27.00mm by 27.00mm with a fin height of 18.00mm.
It is made of aluminum with a black anodized finish.
It uses thermal tape adhesive, which is included with the heat sink.
It is designed to cool BGA packages.