Ready to onboard?
Are you ready to join DistyParts and
grow your business?
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
50 pcs
|
50 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Length | |
| Material | |
| Material Finish | |
| Package Cooled | |
| Power Dissipation @ Temperature Rise | |
| Shape | |
| Tape & Reel | |
| Thermal Resistance @ Forced Air Flow | |
| Thermal Resistance @ Natural | |
| Type | |
| Width |
The 374324B00035G is a board level heat sink produced by Aavid, Thermal Division of Boyd Corporation. It is designed for cooling BGA and FPGA packages. The heat sink features a square pin fin shape which provides efficient heat dissipation in both natural and forced convection environments. Constructed from aluminum with a black anodized finish, it offers a durable and corrosion-resistant surface. Dimensions are 27mm width, 27mm length, and 10mm fin height. Thermal resistance is 30.6°C/W under natural convection and 9.3°C/W at 200 LFM forced air flow. Power dissipation is rated at 3W with a temperature rise of 90°C. The heat sink includes thermal tape adhesive for easy attachment to the component.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.59 | $2.59 |
| 10+ | $2.33 | $2.33 |
| 25+ | $2.22 | $2.22 |
| 50+ | $2.13 | $2.13 |
| 100+ | $2.02 | $2.02 |
| 250+ | $1.93 | $1.93 |
| 500+ | $1.83 | $1.83 |
| 756+ | $1.75 | $1.75 |
| 2,268+ | $1.64 | $1.64 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
Designed for BGA and FPGA packages.
RoHS3 Compliant (unverified).
27mm x 27mm width and length, 10mm fin height.
30.6°C/W in natural convection, 9.3°C/W at 200 LFM forced air.
3W at 90°C temperature rise.
Includes thermal tape adhesive.
Aluminum with black anodized finish.