SL3S1206FUD2/HAA-VB2
NXP Semiconductors
The NXP Semiconductors SL3S1206FUD2/HAA-VB2 is a Chassis Mount Resistor. It is RoHS3 Compliant and REACH Unaffected.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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50 pcs
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50 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
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10 pcs
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10 pcs | On Request | 1 | 28 | On Request | On Request | On Request | On Request |
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The TE Connectivity 328-AG19DC is part of the 300C Series of stamped dual wipe contact DIP sockets. This socket is designed with a closed bottom to prevent solder wicking and standoffs to facilitate board cleaning. Its low profile design contributes to space savings on PCBs.
Key electrical specifications include a contact resistance of 10 milliohms and a contact rating of 2 Amps. The operating temperature range for tin plating is -55°C to +105°C. Mechanical performance is robust, with passed tests for vibration (15 G's) and shock (100 G's), and a contact retention force of 340 grams minimum.
Material specifications include a thermoplastic polyester insulator (UL rated 94V-0) and phosphor bronze contacts with tin/lead plating. The socket is designed for through-hole mounting and is compatible with standard PCB thicknesses and hole sizes, as well as a range of IC pin dimensions.
The 328-AG19DC has undergone rigorous testing, including humidity, thermal shock, temperature cycling, and salt spray tests, demonstrating its suitability for various environmental conditions.
| Qty | Low | High |
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| 1+ | $1.00 | $1.00 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The contact resistance is 10 milliohms.
The contact rating is 2 Amps.
The operating temperature range for tin plating is -55°C to +105°C.
The insulator is thermoplastic polyester (UL rated 94V-0) and the contacts are phosphor bronze with tin/lead plating.
The normal force is 170 grams.
