| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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485 pcs
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485 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 326005R00000G is a board level heat sink from Aavid, Thermal Division of Boyd Corporation, designed to cool TO-5 packages. It features a cylindrical aluminum body with a red anodized finish. The heat sink is attached using a press fit, providing a direct mechanical and thermal connection to the component.
The heat sink has a fin height of 9.52 mm, an inner diameter of 8.07 mm, and an outer diameter of 12.70 mm. Thermal resistance is rated at 57.00°C/W under natural convection and 30.00°C/W with forced air flow at 200 LFM. At a temperature rise of 90°C, the heat sink can dissipate up to 1.8 W.
Constructed from aluminum, the red anodized finish provides a durable surface. The cylindrical shape and compact dimensions make it suitable for board level cooling applications where space is limited. Press fit mounting simplifies assembly onto TO-5 package components.
| Qty | Low | High |
|---|---|---|
| 2,000+ | $3.75 | $3.75 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-5 packages.
57.00°C/W under natural convection and 30.00°C/W with 200 LFM forced air flow.
It can dissipate 1.8 W at a temperature rise of 90°C.
It uses press fit attachment.
Aluminum with a red anodized finish.
Inner diameter 8.07 mm, outer diameter 12.70 mm, and fin height 9.52 mm.
The existing data lists it as RoHS3 compliant, but the status is unverified.