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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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16 pcs
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16 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 326005B00000G is a board level heat sink designed for cooling TO-5 semiconductor packages. It is constructed from aluminum with a black anodized finish, providing corrosion resistance and improved thermal emissivity. The heat sink features a cylindrical shape with an outer diameter of 12.70mm (0.500 inches) and a fin height of 9.52mm (0.375 inches). It attaches to the TO-5 package via a press fit mounting method, ensuring a secure mechanical and thermal interface. Thermal performance is rated at 57.00°C/W under natural convection and 30.00°C/W at 200 LFM forced air flow. The maximum power dissipation is 1.8W at a 90°C temperature rise. This heat sink is suitable for applications requiring efficient thermal management in a compact form factor. The black anodized finish aids in heat radiation and protects the aluminum from oxidation. The press fit design allows for easy installation without additional hardware. The part is RoHS3 compliant and REACH unaffected, though these compliance statuses are unverified. It is commonly used in power supplies, amplifiers, and other electronic devices where TO-5 packages need heat sinking.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.72 | $2.72 |
| 10+ | $2.62 | $2.62 |
| 25+ | $2.54 | $2.54 |
| 50+ | $2.47 | $2.47 |
| 100+ | $2.40 | $2.40 |
| 250+ | $2.03 | $2.03 |
| 500+ | $1.94 | $1.94 |
| 1,000+ | $1.87 | $1.87 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
TO-5 package.
57.00°C/W under natural convection and 30.00°C/W at 200 LFM forced air flow.
1.8W at a 90°C temperature rise.
Aluminum with a black anodized finish.
Press fit onto the TO-5 package.
RoHS3 compliant, but this status is unverified.
Outer diameter 12.70mm, fin height 9.52mm.