| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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20 pcs
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20 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 322605B00000G is a cylindrical aluminum heat sink designed for cooling TO-5 semiconductor packages. It features a black anodized finish and is attached via press fit, ensuring secure thermal contact. The heat sink has an inner diameter of 8.00mm and an outer diameter of 19.05mm with a fin height of 6.35mm.
Thermal performance is specified at 25.00°C/W under 200 LFM forced air flow and 54.00°C/W under natural convection. It can dissipate up to 1.0W at a 60°C temperature rise. The top mount design allows for straightforward integration into a variety of thermal management applications.
Constructed from aluminum with a black anodized finish, the heat sink offers good corrosion resistance and thermal emissivity. The cylindrical shape and press-fit attachment make it suitable for use with TO-5 packaged devices in space-constrained environments.
| Qty | Low | High |
|---|---|---|
| 1+ | $3.09 | $3.09 |
| 10+ | $2.82 | $2.82 |
| 25+ | $2.71 | $2.71 |
| 50+ | $2.62 | $2.62 |
| 100+ | $2.47 | $2.47 |
| 250+ | $2.31 | $2.31 |
| 500+ | $2.24 | $2.24 |
| 1,000+ | $2.15 | $2.15 |
| 2,000+ | $2.14 | $2.14 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
25.00°C/W at 200 LFM forced air and 54.00°C/W in natural convection.
1.0W at a 60°C temperature rise.
TO-5 package.
Press fit, top mount.
Inner diameter 8.00mm, outer diameter 19.05mm, fin height 6.35mm.
Aluminum with a black anodized finish.