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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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22 pcs
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22 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 321127B00000 is a board level heat sink designed for cooling TO-5 semiconductor packages. It features a cylindrical black anodized aluminum construction with a diameter of 15.88mm (0.625"). The heat sink attaches to the component using a threaded coupling method, ensuring a secure mechanical connection.
Thermal performance is specified at 54.00°C/W under natural convection and 25.00°C/W at 200 LFM forced air flow. The power dissipation capability is 1.4W at a 70°C temperature rise. These ratings make it suitable for moderate power dissipation requirements in TO-5 packaged devices.
The black anodized finish provides corrosion resistance and enhances thermal emissivity. As a top mount design, it is intended for vertical orientation on the circuit board, allowing efficient airflow around the fins.
| Qty | Low | High |
|---|---|---|
| 500+ | $6.84 | $6.84 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
54.00°C/W under natural convection and 25.00°C/W at 200 LFM forced air flow.
It is designed for TO-5 packages.
1.4W at a 70°C temperature rise.
15.88mm (0.625").
Aluminum with a black anodized finish.
Via threaded coupling.