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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
15 pcs
|
15 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 311505B00000G is a board-level heat sink designed for cooling TO-5 devices. It features a cylindrical shape made from aluminum with a black anodized finish. The heat sink attaches to the device using a press-fit (push-on) method, ensuring secure thermal contact.
Key thermal specifications include a thermal resistance of 45.00°C/W under 200 LFM forced air flow and 90.00°C/W under natural convection. It can dissipate up to 1.0W at a 70°C temperature rise. The heat sink has an overall width and length of 9.52mm, a fin height of 10.16mm, and an inner diameter of 8.05mm to accommodate TO-5 packages.
This heat sink is suitable for vertical mounting and is commonly used in applications requiring efficient thermal management of TO-5 packaged components. The black anodized finish provides corrosion resistance and improved thermal emissivity.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.82 | $2.82 |
| 10+ | $2.63 | $2.63 |
| 25+ | $2.52 | $2.52 |
| 50+ | $2.42 | $2.42 |
| 100+ | $2.30 | $2.30 |
| 250+ | $2.17 | $2.17 |
| 500+ | $2.10 | $2.10 |
| 1,000+ | $2.05 | $2.05 |
| 2,000+ | $1.99 | $1.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It is designed to cool TO-5 devices.
It is listed as RoHS3 Compliant, but this is unverified.
45.00°C/W at 200 LFM forced air flow and 90.00°C/W under natural convection.
Aluminum with a black anodized finish.
Press fit (push-on) attachment.
Width and length 9.52mm, height 10.16mm, inner diameter 8.05mm, outer diameter 9.52mm.
1.0W at 70°C temperature rise.