| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
9 pcs
|
9 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 302M is a board level vertical heat sink designed for cooling stud mounted semiconductor cases. It features a rectangular shape with fins to enhance heat dissipation.
Constructed from aluminum alloy with a black anodized finish, the heat sink offers a fin height of 50.80mm, width of 38.10mm, and length of 50.80mm. It is attached using a press fit method.
Thermal performance includes a forced air flow thermal resistance of 1.80°C/W at 250 LFM, and power dissipation of 15.0W at 50°C temperature rise. These specifications make it suitable for various thermal management applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $13.55 | $13.55 |
| 2+ | $41.46 | $41.46 |
| 10+ | $13.36 | $13.36 |
| 25+ | $12.52 | $12.52 |
| 50+ | $10.64 | $10.64 |
| 100+ | $10.63 | $10.63 |
| 500+ | $10.44 | $10.44 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
1.80°C/W at 250 LFM forced air flow.
15.0W at 50°C temperature rise.
Length 50.80mm, width 38.10mm, fin height 50.80mm.
Aluminum alloy with black anodized finish.
Press fit.
The RoHS status is listed as RoHS3 Compliant but is unverified.