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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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91 pcs
|
91 pcs | On Request | 1 | On Request | On Request | 2026-02-25 06:16:38 | On Request | On Request |
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The Wakefield-Vette 290-1AB is a low-cost board level heat sink designed for single or dual semiconductor packages. It accommodates TO-218, TO-202, and TO-220 case styles and can be mounted vertically or horizontally on a circuit board.
Constructed from aluminum with a black anodized finish, the heat sink measures 29.97mm in length and 25.40mm in width, with a fin height of 12.70mm. It offers a thermal resistance of 22.00°C/W under natural convection and 7.00°C/W at 400 LFM forced air flow. Power dissipation is rated at 2.0W with a 44°C temperature rise.
Attachment is via bolt-on method, and the footprint dimensions are 1.000" x 1.180". The part weighs 0.0082 lbs (3.72g). This heat sink is suitable for thermal management in a variety of electronic applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.55 | $0.55 |
| 10+ | $0.49 | $0.49 |
| 25+ | $0.46 | $0.46 |
| 50+ | $0.45 | $0.45 |
| 100+ | $0.43 | $0.43 |
| 250+ | $0.41 | $0.41 |
| 500+ | $0.39 | $0.39 |
| 1,000+ | $0.37 | $0.37 |
| 5,000+ | $0.32 | $0.32 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The thermal resistance is 22.00°C/W under natural convection and 7.00°C/W at 400 LFM forced air flow.
It cools TO-218, TO-202, and TO-220 packages.
It uses a bolt-on attachment method and can be mounted vertically or horizontally.
The heat sink is made of aluminum with a black anodized finish.
It is rated for 2.0W at a 44°C temperature rise.