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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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430 pcs
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430 pcs | On Request | 1 | On Request | On Request | 2026-02-25 06:16:38 | On Request | On Request |
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The Wakefield-Vette 287-1AB is a board level heat sink designed for cooling TO-220 semiconductor packages. Constructed from black anodized aluminum, it features a rectangular finned shape with a vertical orientation. The heat sink measures 29.97mm in length, 25.40mm in width, and has a fin height of 12.70mm. It offers a typical thermal resistance of 16.20°C/W under natural convection and 7.80°C/W at 200 LFM forced air flow. Power dissipation is rated at 4.0W for a 65°C temperature rise. Attachment is achieved via bolt-on and PC pin methods, allowing for secure mounting and wave soldering directly to the circuit board. This heat sink is suitable for space-constrained applications requiring efficient heat removal from TO-220 devices.
16.20°C/W under natural convection and 7.80°C/W at 200 LFM forced air flow.
TO-220 packages.
Aluminum with a black anodized finish.
Length 29.97mm, width 25.40mm, fin height 12.70mm.
Bolt-on and PC pin attachment.
4.0W at a 65°C temperature rise.