| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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1 pcs
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1 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 274-2AB from Wakefield-Vette is a board level heat sink designed to cool TO-220 semiconductor packages. It is constructed from aluminum with a black anodized finish, providing effective thermal management in a compact form factor.
This heat sink measures 19.05mm in length and 13.21mm in width, with a fin height of 0.500" (12.70mm). It offers a thermal resistance of 25.00°C/W under natural convection, improving to 7.00°C/W at 400 LFM forced airflow. The typical power dissipation is 2.0W at a 50°C temperature rise.
Mounting is accomplished via a bolt-on attachment method, and the heat sink is designed to fit standard TO-220 packages. Its low-height profile makes it suitable for space-constrained applications such as power supplies, motor drives, and audio amplifiers.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.59 | $0.59 |
| 10+ | $0.53 | $0.53 |
| 25+ | $0.50 | $0.50 |
| 50+ | $0.48 | $0.48 |
| 100+ | $0.47 | $0.47 |
| 250+ | $0.44 | $0.44 |
| 500+ | $0.43 | $0.43 |
| 1,000+ | $0.40 | $0.40 |
| 1,500+ | $0.40 | $0.40 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
25.00°C/W under natural convection; 7.00°C/W at 400 LFM forced airflow.
It is designed for TO-220 packages.
Bolt-on attachment.
2.0W typical at 50°C temperature rise.
Length 19.05mm, width 13.21mm, fin height 0.500" (12.70mm).