| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
600 pcs
|
600 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Wakefield-Vette 262-75ABE01 is a board level, vertical heat sink designed for cooling TO-220 semiconductor packages. It is constructed from aluminum with a black anodized finish, which enhances heat dissipation and provides corrosion resistance.
The heat sink has a rectangular finned shape. It mounts via press fit and PC pin, allowing secure attachment to the TO-220 device and the PCB. The fin height is 0.500 inches (12.70 mm), width 14.47 mm, and length 19.05 mm.
Thermal performance: typical natural convection thermal resistance is 26.70°C/W. With forced air at 200 LFM, the thermal resistance drops to 10.00°C/W. The sink can dissipate up to 3.0W at an 80°C temperature rise. This performance suits low to moderate power applications where board-level cooling is required.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.61 | $0.61 |
| 10+ | $0.55 | $0.55 |
| 25+ | $0.53 | $0.53 |
| 50+ | $0.52 | $0.52 |
| 100+ | $0.52 | $0.52 |
| 250+ | $0.46 | $0.46 |
| 500+ | $0.42 | $0.42 |
| 1,000+ | $0.39 | $0.39 |
| 5,000+ | $0.36 | $0.36 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The typical natural convection thermal resistance is 26.70°C/W. With forced air at 200 LFM, it drops to 10.00°C/W.
It is designed for the TO-220 package type.
RoHS status is listed as RoHS3 compliant (unverified, low confidence).
It uses press fit and PC pin attachment method.
It is made of aluminum with a black anodized finish.