| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,000 pcs
|
2000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 26176CTE is a board level heat sink from Wakefield-Vette designed for cooling TO-263 (D²Pak) surface mount packages. It features a rectangular shape with fins to enhance heat dissipation. The heat sink is constructed from copper with a tin finish, providing good thermal conductivity and corrosion resistance. It uses a clip attachment method for secure mounting to the package.
Key specifications include a width of 25.40mm (1.000"), a length of 19.38mm (0.763"), and a fin height of 11.43mm (0.450"). The thermal resistance is rated at 11.00°C/W under natural convection conditions. This heat sink is suitable for applications requiring passive cooling of TO-263 devices in natural convection environments.
The part is RoHS3 compliant and has an MSL of 1 (unlimited). It is commonly used in power management, motor control, and other circuits where efficient thermal management of surface mount packages is needed.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.31 | $1.31 |
| 10+ | $1.18 | $1.18 |
| 25+ | $1.15 | $1.15 |
| 50+ | $1.12 | $1.12 |
| 100+ | $1.06 | $1.06 |
| 250+ | $1.00 | $1.00 |
| 500+ | $0.95 | $0.95 |
| 1,000+ | $0.90 | $0.90 |
| 2,000+ | $0.85 | $0.85 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It is designed for the TO-263 (D²Pak) package.
It is listed as RoHS3 Compliant, but this is unverified and low confidence.
The thermal resistance is 11.00°C/W under natural convection.
It is made of copper with a tin finish.
It uses a clip attachment method.
Width: 25.40mm, Length: 19.38mm, Fin Height: 11.43mm.