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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
9 pcs
|
9 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Diameter | |
| Length | |
| Material Finish | |
| Medical Grade | |
| Military Grade | |
| Mounting Method | |
| Package Cooled | |
| Shape | |
| Tape & Reel | |
| Thermal Resistance @ Natural | |
| Type | |
| Width |
The 260-4T5E is a board-level heat sink from Wakefield-Vette designed for cooling TO-5 packaged semiconductor devices. It features a cylindrical shape with a width of 9.65mm, length of 9.40mm, and an inner diameter of 7.37mm. The heat sink is made with a black ebonol material finish. It is mounted using a bolt-on attachment method. Thermal performance is rated at 14.00°C/W under natural convection conditions. The part is RoHS3 compliant and REACH unaffected, with an MSL rating of 1 (unlimited). This heat sink is suitable for applications requiring efficient thermal management in confined board-level spaces.
| Qty | Low | High |
|---|---|---|
| 1+ | $23.16 | $23.16 |
| 10+ | $20.94 | $20.94 |
| 20+ | $20.09 | $20.09 |
| 50+ | $19.62 | $19.62 |
| 100+ | $19.61 | $19.61 |
| 500+ | $19.22 | $19.22 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
14.00°C/W under natural convection.
TO-5 package.
Bolt-on attachment.
Black ebonol.
Width 9.65mm, length 9.40mm, inner diameter 7.37mm.
RoHS3 Compliant (unverified).
1 Unlimited (unverified).