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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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4 pcs
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4 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 234-75AB is a low profile board level heat sink from Wakefield-Vette designed for cooling TO-220 semiconductor packages. It is constructed from aluminum with a black anodized finish for enhanced thermal performance and corrosion resistance.
The heat sink measures 20.07mm in length, 14.47mm in width, and has a fin height of 12.70mm. It attaches to the component using a bolt-on method. Thermal performance is rated at 28.50°C/W under natural convection and 7.50°C/W at 400 LFM forced air flow. Power dissipation is 2.0W at a 57°C temperature rise.
This rectangular finned heat sink is suitable for vertical mounting on standard PC board footprints. It is RoHS3 compliant and REACH unaffected.
| Qty | Low | High |
|---|---|---|
| 5,000+ | $0.23 | $0.23 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
28.50°C/W under natural convection and 7.50°C/W at 400 LFM forced air flow.
TO-220.
Aluminum with black anodized finish.
Bolt on.
Length 20.07mm, width 14.47mm, fin height 12.70mm.
RoHS3 compliant (unverified).