| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
3,760 pcs
|
3760 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Attachment Method | |
| Fin Height | |
| Lead Style | |
| Length | |
| Material | |
| Material Finish | |
| Package Cooled | |
| Power Dissipation @ Temperature Rise | |
| SVHC Present | |
| Shape | |
| Tape & Reel | |
| Thermal Resistance @ Forced Air Flow | |
| Thermal Resistance @ Natural | |
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The Wakefield-Vette 218-40CTE3 is a surface mount heat sink designed for cooling SMD packages. It is constructed from copper with a matte tin plated finish, ensuring excellent thermal conductivity and corrosion resistance. The heat sink has a rectangular shape with fins and measures 22.86mm (0.900") in width, 8.13mm (0.320") in length, and 10.16mm (0.400") in height. It utilizes an SMD pad attachment method for easy mounting. Thermally, the 218-40CTE3 offers a natural convection thermal resistance of 31.00°C/W and a forced air thermal resistance of 21.00°C/W at 200 LFM. It can dissipate up to 2.0W at a 62°C temperature rise. This heat sink is RoHS3 compliant and has an MSL of 1 (unlimited). It is suitable for applications requiring efficient thermal management in confined spaces.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.92 | $0.92 |
| 10+ | $0.81 | $0.81 |
| 25+ | $0.79 | $0.79 |
| 50+ | $0.76 | $0.76 |
| 100+ | $0.72 | $0.72 |
| 250+ | $0.68 | $0.68 |
| 500+ | $0.66 | $0.66 |
| 1,000+ | $0.63 | $0.63 |
| 5,000+ | $0.54 | $0.54 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
10.16 mm (0.400 inches).
Copper with tin plating.
31.00°C/W natural convection, 21.00°C/W at 200 LFM forced air.
2.0W at 62°C temperature rise.
SMD Pad.
Yes, RoHS3 Compliant (unverified).
SMD packages.