| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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173 pcs
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173 pcs | On Request | 1 | On Request | On Request | 2010 | On Request | On Request |
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The Wakefield-Vette 217-36CTRE6 is a board level heat sink designed for surface mount thermal management. It is constructed from copper with a tin finish, providing efficient heat transfer and corrosion resistance. The heat sink has a rectangular shape with fins, measuring 15.24mm (0.600") in width and 18.80mm (0.740") in length, with a fin height of 9.14mm (0.360"). It is a top mount design with SMD pad attachment, making it suitable for direct soldering onto PCBs.
Thermal performance is specified at 16.00°C/W with forced air flow of 200 LFM and 55.00°C/W under natural convection. The power dissipation rating is 1.0W at a 55°C temperature rise. This heat sink is compatible with a variety of package types including D²Pak (TO-263), SOL-20, SOT-223, and TO-220, making it a versatile choice for cooling multiple components in a design.
Typical applications include thermal management for power management ICs, voltage regulators, and other semiconductor devices in the listed packages. The copper material ensures high thermal conductivity, while the tin finish provides a reliable solderable surface for surface mount assembly.
| Qty | Low | High |
|---|---|---|
| 1+ | $147.57 | $147.57 |
| 10+ | $138.77 | $138.77 |
| 25+ | $133.57 | $133.57 |
| 50+ | $128.16 | $128.16 |
| 100+ | $126.17 | $126.17 |
| 250+ | $124.05 | $124.05 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
D²Pak (TO-263), SOL-20, SOT-223, TO-220.
Copper with a tin finish.
Width 15.24mm, length 18.80mm, fin height 9.14mm.
55.00°C/W.
SMD Pad.
RoHS3 Compliant (unverified, low confidence).
1.0W at 55°C temperature rise.