| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
78 pcs
|
78 pcs | On Request | 1 | On Request | On Request | N/A | On Request | On Request | |
|
40 pcs
|
40 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Connector Style | |
| Contact Finish | |
| Contact Finish Thickness | |
| Contact Plating Thickness | |
| Features | |
| Height Above Board | |
| Lead Style | |
| Memory Type | |
| Mounting Feature | |
| Mounting Type | |
| Number of Positions | |
| Package Type | |
| Packaging Type |
The TE Connectivity 2013289-1 is a DDR3 SODIMM socket designed for memory module applications. It features 204 positions in a right angle surface mount configuration with a 25° angle, allowing for low-profile installation. The socket has a height above board of 5.2 mm, making it suitable for compact designs.
The contacts are finished with gold flash plating, ensuring reliable electrical connections. The socket includes board guides and latches to facilitate easy module insertion and retention. It is packaged in a tray for handling and assembly.
This socket is part of TE Connectivity's DDR3 DIMM socket portfolio, which is designed to meet JEDEC industry standards for high-speed data applications. Typical applications include servers, notebook PCs, and communications equipment.
204 positions.
Surface mount with a 25° angle.
Gold flash.
5.2 mm.
Board guides and latches.
DDR3 SDRAM.
Tray.