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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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10 pcs
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10 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The TE Connectivity 2-641605-2 is a 28-position (2 x 14) DIP socket designed for through hole mounting. It features a 0.6" (15.24mm) row spacing and a 2.54mm (0.100") pitch, making it suitable for standard dual in-line package ICs.
The socket uses beryllium copper contacts with a gold finish (30.0µin / 0.76µm) for reliable electrical connections. The housing is made of glass-filled thermoplastic, providing durability and thermal stability. The open frame design allows for airflow and easy inspection of solder joints.
This socket operates over a wide temperature range of -55°C to 125°C, making it suitable for industrial and automotive applications. Termination is via solder connections.
The socket has 28 positions arranged as 2 rows of 14 (2 x 14).
The pitch is 2.54mm (0.100").
It is a through hole mount socket.
The operating temperature range is -55°C to 125°C.
Contacts are beryllium copper with a gold finish of 30.0µin (0.76µm).