1SG280HU3F50E2VG Intel FPGA with 2.8 million logic elements and 704 I/O. Surface mount package 2397-BBGA/FCBGA.
Mfr Part #:

1SG280HU3F50E2VG

Available from 1 distributors
Mfr Name: Intel
Intel
Intel FPGA with 2.8 million logic elements and 704 I/O. Surface mount package 2397-BBGA/FCBGA.
Total Stock: 3 pcs

1SG280HU3F50E2VG Available from 1 distributor

Authorised
Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
3 pcs
3 pcs On Request 1 On Request On Request On Request On Request On Request

1SG280HU3F50E2VG Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Mounting Type
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Voltage

1SG280HU3F50E2VG Description

Short technical summary and product information.

The Intel 1SG280HU3F50E2VG is a high-capacity Field Programmable Gate Array (FPGA) from the Stratix 10 GX family. It features 2.8 million logic elements and 350,000 logic array blocks, providing substantial logic capacity for complex digital designs. The device offers 704 I/O pins for extensive connectivity. It operates from a supply voltage range of 0.77V to 0.97V and is rated for a junction temperature range of 0°C to 100°C. The FPGA is designed for surface mount assembly and is housed in a 2397-BBGA (Ball Grid Array) package, also available as FCBGA, with a supplier device package of 2397-FBGA, FC (50x50). This part is suitable for high-performance computing, signal processing, and networking applications requiring large-scale integration and high I/O count.

1SG280HU3F50E2VG Quick Information

Product Type: FPGA (Field Programmable Gate Array)
Series: Stratix 10 GX
Canonical Name: Intel Stratix 10 GX FPGA 1SG280HU3F50E2VG
Subcategory: Embedded FPGAs

1SG280HU3F50E2VG Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

1SG280HU3F50E2VG Features

  • 2.8 million logic elements for high density.
  • 704 I/O pins for extensive connectivity.
  • Supply voltage 0.77V to 0.97V.
  • Surface mount in 2397-BBGA package.
  • Operating temperature 0°C to 100°C.

1SG280HU3F50E2VG Applications

  • Used in high-performance computing systems.
  • Suitable for complex signal processing.
  • Ideal for large-scale networking hardware.
  • Deployed in advanced aerospace electronics.

1SG280HU3F50E2VG FAQs

5 frequently asked questions generated from this part’s specifications.
How many logic elements does the 1SG280HU3F50E2VG have?

2,800,000 logic elements.

What is the I/O pin count?

704 I/O pins.

What is the supply voltage range?

0.77V to 0.97V.

What is the package type?

2397-BBGA, FCBGA (also 2397-FBGA, FC 50x50).

What is the operating temperature range?

0°C to 100°C (junction temperature).

1SG280HU3F50E2VG Alternate Parts

Same form/fit/function or matching attribute configuration across different manufacturers.
View All Alternate Parts
1SG280HU3F50E3VG
1SG280HU3F50E3VG
Intel
IC FPGA 704 I/O 2397BGA
View Part
1SG280LU3F50E3VGAS
1SG280LU3F50E3VGAS
Intel
IC FPGA 704 I/O 2397BGA
View Part
1SG280HU3F50E2VGS3
1SG280HU3F50E2VGS3
Intel
IC FPGA 704 I/O 2397FBGA
View Part
1SG280LU3F50E3VGS3
1SG280LU3F50E3VGS3
Intel
IC FPGA 704 I/O 2397FBGA
View Part
Home
Account

Categories