| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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320 pcs
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320 pcs | On Request | 1 | On Request | On Request | 18+ | On Request | On Request |
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| Manufacturer Name |
The 1GC1-6234 is an electronic component manufactured by Agilent Technologies. It comes in a QFN-16 package, a quad flat no-lead package with 16 terminals commonly used in modern electronic assemblies.
The QFN-16 package provides a compact footprint and low profile, making it well-suited for designs where board space is limited. The exposed thermal pad helps dissipate heat efficiently. Surface-mount technology supports automated assembly, and the package's short lead lengths contribute to reduced parasitic effects.
Designers should integrate the component based on its specified package footprint and thermal requirements to achieve reliable performance in the target application.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.17 | $1.17 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The 1GC1-6234 is available in a QFN-16 package.
Yes, QFN-16 designates a quad flat no-lead package with 16 leads.