| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,278 pcs
|
2278 pcs | On Request | 1 | On Request | On Request | 24+ | On Request | On Request |
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The TE Connectivity 1761505-1 is a 604-pin PGA (Pin Grid Array) ZIF (Zero Insertion Force) socket designed for high-density IC packaging. It features a 25x31 grid arrangement with a pitch of 1.27mm (0.050"), enabling compact routing on the PCB.
The socket uses a surface mount mounting type and an open frame construction, which facilitates heat dissipation and cleaning. Contacts are finished with gold at 30µin (0.76µm) thickness for reliable electrical performance and corrosion resistance. The ZIF mechanism allows easy insertion and removal of the IC without applying excessive force, reducing the risk of damage to both the socket and the component. This socket is ideal for applications that require frequent device swapping, such as programming, testing, or prototyping high-pin-count PGA packages.
| Qty | Low | High |
|---|---|---|
| 220+ | $9.70 | $9.70 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It has 604 positions arranged in a 25x31 grid.
1.27mm (0.050 inches).
Surface mount.
Gold with a thickness of 30µin (0.76µm).
Yes, it has an open frame design.
It is a PGA (Pin Grid Array) ZIF (Zero Insertion Force) socket.