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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
420 pcs
|
420 pcs | On Request | 1 | On Request | On Request | 2026-02-25 06:16:38 | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Backing, Carrier | |
| Color | |
| Outline | |
| Shape | |
| Thermal Conductivity | |
| Thermal Resistivity | |
| Thickness | |
| Type | |
| Usage |
This is a thermal interface pad manufactured by Wakefield-Vette, designed for use with TO-220 packages. It measures 22.00mm x 16.51mm with a thickness of 0.152mm (0.0060 inches). The pad is rectangular and gray in color.
Thermal performance: thermal resistivity of 0.40°C/W and thermal conductivity of 0.5W/m-K. The backing material is polyimide, providing electrical insulation.
Application: suitable for heat transfer between TO-220 semiconductor devices and heatsinks. The pad is electrically insulating, reducing the need for additional insulators.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.85 | $0.85 |
| 10+ | $0.74 | $0.74 |
| 25+ | $0.71 | $0.71 |
| 50+ | $0.62 | $0.62 |
| 100+ | $0.60 | $0.60 |
| 1,000+ | $0.51 | $0.51 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
RoHS3 compliant (unverified).
TO-220 package.
22.00mm x 16.51mm with 0.152mm thickness.
Thermal resistivity 0.40°C/W, thermal conductivity 0.5W/m-K.
Gray.
Polyimide.
REACH unaffected (unverified).