| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
4 pcs
|
4 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Backing, Carrier | |
| Color | |
| Outline | |
| Shape | |
| Thermal Conductivity | |
| Thermal Resistivity | |
| Thickness | |
| Type | |
| Usage |
The 175-6-210P is a thermal pad from Wakefield-Vette designed for use with TO-220 semiconductor packages. It measures 17.45mm by 14.27mm with a thickness of 0.152mm (0.0060 inches). The pad is gray in color and features a polyimide backing material, providing electrical insulation while facilitating heat transfer.
With a thermal conductivity of 0.5 W/m-K and a thermal resistivity of 0.40°C/W, this pad offers effective thermal management for power devices. The rectangular shape is pre-cut to fit TO-220 outlines, simplifying assembly. The pad is RoHS3 compliant and has an MSL of 1 (unlimited).
This thermal interface material is suitable for applications requiring reliable heat dissipation from TO-220 transistors, voltage regulators, and other through-hole power components. The polyimide carrier provides durability and resistance to high temperatures.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.65 | $0.65 |
| 10+ | $0.64 | $0.64 |
| 250+ | $0.57 | $0.57 |
| 500+ | $0.56 | $0.56 |
| 1,000+ | $0.47 | $0.47 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
0.152mm (0.0060 inches).
17.45mm x 14.27mm.
0.5W/m-K.
0.40°C/W.
Polyimide.
Yes, RoHS3 compliant (unverified).
TO-220.