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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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12 pcs
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12 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Mill-Max 115-93-628-41-001000 is a 28-position dual-in-line (DIP) IC socket designed for through-hole mounting. It features a 0.6" (15.24mm) row spacing and a 2.54mm (0.100") pitch, making it suitable for standard 28-pin DIP packages. The socket uses an open-frame construction with a housing made of polycyclohexylenedimethylene terephthalate (PCT) and polyester.
Contacts are made of beryllium copper with a tin-lead finish (30.0µin / 0.76µm thickness), providing reliable electrical connections. The operating temperature range spans -55°C to 125°C, allowing use in a wide variety of environments. Termination is via solder connections to the PCB.
This socket is commonly used in prototyping, production, and testing applications where a 28-pin DIP IC needs to be inserted and removed without soldering directly to the board. The open-frame design aids in airflow and inspection of solder joints.
28 positions arranged as 2 rows of 14 (2 x 14).
2.54mm (0.100").
Through-hole mounting with solder termination.
-55°C to 125°C.
Beryllium copper contacts with a tin-lead finish (30.0µin / 0.76µm).
Polycyclohexylenedimethylene Terephthalate (PCT) and polyester.